	US 11,988,690 B2
	Current transducer
Thomas Guillemin, Sillingy (FR); and Fabien Millet, Bons-en-chablais (FR)
Assigned to LEM International SA, Meyrin (CH)
Appl. No. 18/283,160
Filed by LEM International SA, Meyrin (CH)
PCT Filed Mar. 4, 2022, PCT No. PCT/EP2022/055576 § 371(c)(1), (2) Date Sep. 20, 2023, PCT Pub. No. WO2022/200016, PCT Pub. Date Sep. 29, 2022.
Claims priority of application No. 21164334 (EP), filed on Mar. 23, 2021.
Prior Publication US 2024/0085462 A1, Mar. 14, 2024
Int. Cl. G01R 33/02 (2006.01); G01R 15/18 (2006.01); G01R 15/20 (2006.01); G01R 33/07 (2006.01); G01R 33/09 (2006.01); B82Y 25/00 (2011.01); B82Y 35/00 (2011.01); B82Y 40/00 (2011.01)

CPC G01R 15/185 (2013.01) [G01R 15/207 (2013.01); G01R 33/02 (2013.01); G01R 33/07 (2013.01); G01R 33/093 (2013.01); B82Y 25/00 (2013.01); B82Y 35/00 (2013.01); B82Y 40/00 (2013.01)]

7 Claims

1. A current transducer comprising a housing including a base and a cover, a magnetic circuit mounted within a cavity of the base, the magnetic circuit comprising a magnetic core and a least one coil wound around the magnetic core, and an electric circuit comprising a first circuit board mounted within the housing, the first circuit board comprising a signal processing circuit connected to a magnetic field detector and to the coil, wherein the current transducer further comprises a second circuit board comprising one or more power amplifiers mounted thereon, the second circuit board being integrated on an inner side of a metallic support substrate, the metal support substrate forming an outer layer of said cover, the metallic support substrate fixed to the base to cover the cavity of the base therein with the second circuit board forming an inner side of the cover facing the first circuit board, the first and second circuit boards interconnected electrically by electrical interconnections.