US 11,988,621 B2
Thermal interface material detection through an electrical conductivity test
Shawn Matthew Johnston, Rochester, MN (US); Clinton William Erie, Adams, MN (US); Ryan Paske, Oronoco, MN (US); Steven Charles Erickson, Rochester, MN (US); and Michael John MacPherson, Elgin, MN (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Aug. 16, 2021, as Appl. No. 17/445,099.
Prior Publication US 2023/0049585 A1, Feb. 16, 2023
Int. Cl. G01N 25/18 (2006.01); F28D 15/00 (2006.01); F28D 21/00 (2006.01)
CPC G01N 25/18 (2013.01) [F28D 15/00 (2013.01); F28D 2021/0029 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a heat dissipating device stack up includes a heat dissipating device, a thermal interface material, a heat generating component, and a printed circuit board;
the heat dissipating device disposed on the thermal interface material, the thermal interface material disposed on the heat generating component, and the heat generating component disposed on the printed circuit board, wherein the thermal interface material is electrically conductive and the heat generating component is electrically nonconductive; and
a channel in a body of the heat dissipating device with an embedded conductive probe, wherein a first end of the embedded conductive probe leads to a lower surface of the body of the heat dissipating device and a second end of the embedded conductive probe leads to an upper surface of the body of the heat dissipating device.