CPC F28F 21/089 (2013.01) [B32B 7/023 (2019.01); B32B 7/027 (2019.01); B32B 7/12 (2013.01); B32B 27/36 (2013.01); G02B 1/04 (2013.01); G02B 5/208 (2013.01); G02B 5/26 (2013.01); B32B 2255/205 (2013.01); B32B 2307/732 (2013.01); F28F 2245/06 (2013.01)] | 24 Claims |
1. A radiative cooling device comprising an infrared radiative layer for radiating infrared light from a radiative surface and a light reflective layer disposed on the side opposite to the presence side of the radiative surface of the infrared radiative layer,
wherein the infrared radiative layer comprises a resin material layer having a thickness adjusted to discharge a greater thermal radiation energy than absorbed solar light energy in a wavelength band ranging from 8 μm to 14 μm, and
wherein the thickness of the resin material layer is adjusted to obtain:
light absorption characteristics that provide light absorbance equal to or less than 13% for a wavelength average from 0.4 μm to 0.5 μm, light absorbance equal to or less than 4% for a wavelength average from 0.5 μm to 0.8 μm, light absorbance equal to or less than 1% for a wavelength average from 0.8 μm to 1.5 μm, and light absorbance equal to or less than 40% for a wavelength average from 1.5 μm to 2.5 μm; and
heat emissivity characteristics of equal to or greater than 40% for wavelength average of the emissivity from 8 μm to 14 μm.
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