US 11,988,453 B2
Thermal management planes
Ryan J. Lewis, Boulder, CO (US); Ronggui Yang, Boulder, CO (US); and Yung-Cheng Lee, Boulder, CO (US)
Assigned to KELVIN THERMAL TECHNOLOGIES, INC., Seattle, WA (US)
Filed by Kelvin Thermal Technologies, Inc., Boulder, CO (US)
Filed on Feb. 7, 2022, as Appl. No. 17/666,537.
Application 17/666,537 is a continuation in part of application No. 17/529,248, filed on Nov. 17, 2021.
Application 17/529,248 is a continuation in part of application No. 15/930,016, filed on May 12, 2020, granted, now 11,598,594.
Application 17/529,248 is a continuation of application No. 15/974,306, filed on May 8, 2018.
Application 15/930,016 is a continuation in part of application No. 14/857,567, filed on Sep. 17, 2015, granted, now 10,731,925.
Claims priority of provisional application 62/503,080, filed on May 8, 2017.
Claims priority of provisional application 62/069,564, filed on Oct. 28, 2014.
Claims priority of provisional application 62/051,761, filed on Sep. 17, 2014.
Prior Publication US 2022/0163268 A1, May 26, 2022
Int. Cl. F28D 15/02 (2006.01); F28D 15/04 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01)
CPC F28D 15/0283 (2013.01) [F28D 15/0233 (2013.01); F28D 15/04 (2013.01); H01L 23/427 (2013.01); H05K 7/20336 (2013.01); F28D 15/0241 (2013.01); F28F 2265/00 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A thermal management plane comprising:
a top casing that is hermetically sealed and bondable with copper;
a bottom casing that is hermetically sealed and bondable with copper;
a wick disposed between the top casing and the bottom casings, wherein the wick has a non-tubular shape, and wherein the wick has sides capped with a cap so that a meniscus does not form and proceed underneath the cap;
a working fluid disposed between the top casing and the bottom casing; and
a copper hermetic seal between the top casing and the bottom casing.