US 11,988,404 B2
Infrared sensor module, air conditioner, and air conditioner control system
Takaaki Hiramatsu, Osaka (JP); Takanori Sugiyama, Osaka (JP); and Hiroshi Yamanaka, Fukui (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 16/977,913
Filed by PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
PCT Filed Mar. 14, 2019, PCT No. PCT/JP2019/010701
§ 371(c)(1), (2) Date Sep. 3, 2020,
PCT Pub. No. WO2019/188375, PCT Pub. Date Oct. 3, 2019.
Claims priority of application No. 2018-062428 (JP), filed on Mar. 28, 2018.
Prior Publication US 2020/0400337 A1, Dec. 24, 2020
Int. Cl. F24F 11/00 (2018.01); F24F 11/79 (2018.01); G01J 5/10 (2006.01); F24F 110/10 (2018.01); F24F 120/12 (2018.01); G01J 5/00 (2022.01); G01J 5/48 (2022.01)
CPC F24F 11/79 (2018.01) [G01J 5/10 (2013.01); F24F 2110/10 (2018.01); F24F 2120/12 (2018.01); G01J 2005/0077 (2013.01); G01J 5/485 (2022.01)] 14 Claims
OG exemplary drawing
 
1. An infrared sensor module, comprising:
an infrared sensor configured to detect an infrared ray and output a thermal image, which includes a background temperature of the thermal image;
a temperature sensor configured to detect a temperature of the infrared sensor; and
at least one processor configured to process output signals of the infrared sensor and the temperature sensor,
the at least one processor being configured to estimate a temperature distribution in a space between the infrared sensor and a background in a detection direction of the infrared sensor based on the background temperature of the thermal image and the temperature of the infrared sensor.