US 11,988,401 B2
Thermal testing for hybrid datacenter cooling systems
Ali Heydari, Albany, CA (US)
Assigned to Nvidia Corporation, Santa Clara, CA (US)
Filed by Nvidia Corporation, Santa Clara, CA (US)
Filed on Jul. 9, 2021, as Appl. No. 17/371,878.
Prior Publication US 2023/0008636 A1, Jan. 12, 2023
Int. Cl. F24F 11/49 (2018.01); H05K 7/20 (2006.01)
CPC F24F 11/49 (2018.01) [H05K 7/20254 (2013.01); H05K 7/20745 (2013.01); H05K 7/2079 (2013.01); H05K 7/20836 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A thermal load bank (TLB) system to test a hybrid datacenter cooling system, the TLB system comprising:
one or more thermal features comprising one or more heaters, the one or more thermal features to generate heat within the TLB system; and
one or more hybrid cooling features comprising at least one of a fan or a fluid conduit, the one or more hybrid cooling features to provide air cooling response and liquid cooling response to the heat generated by the one or more thermal features, the liquid cooling response being via liquid of the hybrid datacenter cooling system.