	US 11,987,863 B2
	Plated steel sheet
Takuya Mitsunobu, Tokyo (JP); Takehiro Takahashi, Tokyo (JP); and Hiroshi Takebayashi, Tokyo (JP)
Assigned to NIPPON STEEL CORPORATION, Tokyo (JP)
Appl. No. 18/040,903
Filed by NIPPON STEEL CORPORATION, Tokyo (JP)
PCT Filed Aug. 19, 2021, PCT No. PCT/JP2021/030398 § 371(c)(1), (2) Date Feb. 7, 2023, PCT Pub. No. WO2022/085287, PCT Pub. Date Apr. 28, 2022.
Claims priority of application No. 2020-175786 (JP), filed on Oct. 20, 2020.
Prior Publication US 2023/0295775 A1, Sep. 21, 2023
Int. Cl. C22C 18/04 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); C21D 9/46 (2006.01); C22C 18/00 (2006.01); C22C 21/00 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C23C 2/02 (2006.01); C23C 2/06 (2006.01); C23C 2/12 (2006.01); C23C 2/26 (2006.01); C23C 2/28 (2006.01); C23C 2/40 (2006.01); C23C 30/00 (2006.01)

CPC C22C 18/04 (2013.01) [B32B 15/012 (2013.01); B32B 15/013 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C21D 9/46 (2013.01); C22C 18/00 (2013.01); C22C 21/00 (2013.01); C22C 38/00 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C23C 2/02 (2013.01); C23C 2/022 (2022.08); C23C 2/06 (2013.01); C23C 2/12 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/285 (2013.01); C23C 2/29 (2022.08); C23C 2/40 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); Y10T 428/1259 (2015.01); Y10T 428/12667 (2015.01); Y10T 428/12757 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/265 (2015.01)]

6 Claims

1. A plated steel sheet comprising:

a steel sheet; and

a plating layer that is formed on at least a part of a surface of the steel sheet,

wherein a chemical composition of the plating layer includes, by mass%,

Al: 6.00% to 35.00%,

Mg: 3.00% to 15.00%,

La+Ce: 0.0001% to 0.5000% in total,

Si: 0% to 2.00%,

Ca: 0% to 2.00%,

Fe: 0% to 2.00%,

Sb: 0% to 0.50%,

Sr: 0% to 0.50%,

Pb: 0% to 0.50%,

Sn: 0% to 1.00%,

Cu: 0% to 1.00%,

Ti: 0% to 1.00%,

Ni: 0% to 1.00%,

Mn: 0% to 1.00%, and

a remainder of Zn and impurities, and

in a surface of the plating layer,

an area ratio of a lamellar structure in which an (Al—Zn) phase and a MgZn₂phase are arranged in layers is 10% to 95%,

a lamellar spacing of the lamellar structure is 2.5 μm or less, and

an area ratio of an (Al—Zn) dendrite is 10% or less.