US 11,987,731 B2
Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
Maki Itoh, Ichihara (JP); Akihiro Nakamura, Ichihara (JP); and Michitaka Suto, Ichihara (JP)
Assigned to DOW TORAY CO., LTD., Tokyo (JP)
Appl. No. 17/267,351
Filed by DOW TORAY CO., LTD., Tokyo (JP)
PCT Filed Aug. 13, 2019, PCT No. PCT/JP2019/031808
§ 371(c)(1), (2) Date May 19, 2021,
PCT Pub. No. WO2020/032285, PCT Pub. Date Feb. 13, 2020.
Claims priority of application No. 2018-151131 (JP), filed on Aug. 10, 2018.
Prior Publication US 2021/0284888 A1, Sep. 16, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. C09J 183/04 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); C08G 77/00 (2006.01); C08G 77/08 (2006.01); C08G 77/16 (2006.01); C08G 77/20 (2006.01); C08G 77/22 (2006.01); C09J 7/38 (2018.01)
CPC C09J 183/04 (2013.01) [B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); C08G 77/08 (2013.01); C08G 77/16 (2013.01); C08G 77/20 (2013.01); C08G 77/22 (2013.01); C08G 77/80 (2013.01); C09J 7/38 (2018.01); B32B 2457/20 (2013.01); C09J 2203/326 (2013.01); C09J 2301/162 (2020.08); C09J 2301/302 (2020.08)] 13 Claims
 
1. A pressure sensitive adhesive layer-forming organopolysiloxane composition, the composition comprising:
(A) a chain organopolysiloxane having alkenyl groups in numbers greater than 1 on average within the molecule;
(B) an organopolysiloxane resin, wherein the total content of hydroxyl groups and hydrolyzable groups with respect to all silicon atoms in the molecule is 9 mole % or less, and the weight average molecular weight (Mw) measured in terms of standard polystyrene by gel permeation chromatography (GPC) is less than 4500;
(C) an organohydrogenpolysiloxane having at least two Si—H bonds in the molecule; and
(D) an effective amount of a hydrosilylation reaction catalyst; and optionally
(A′) a chain organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule;
wherein the mass ratio of component (B) to the sum of components (A) and (A′) is within a range of 0.9 to 1.8, and the shear storage elastic modulus G′ at −20° C. of a pressure sensitive adhesive layer obtained by curing the composition is within a range of 0.01 to 1.0 MPa.