US 11,987,717 B2
Air-stable conductive ink
Chuan-Jian Zhong, Endwell, NY (US); Shan Yan, Medford, NY (US); Shiyao Shan, Vestal, NY (US); Ning He, Xiamen (CN); Ning Kang, Irvine, CA (US); and Jin Luo, Vestal, NY (US)
Assigned to The Research Foundation for The State University of New York, Binghamton, NY (US)
Filed by The Research Foundation for The State University of new York, Binghamton, NY (US)
Filed on Jul. 9, 2021, as Appl. No. 17/305,583.
Claims priority of provisional application 63/050,523, filed on Jul. 10, 2020.
Prior Publication US 2022/0010160 A1, Jan. 13, 2022
Int. Cl. C09D 11/52 (2014.01); B41M 5/00 (2006.01); B41M 7/00 (2006.01); C09D 11/033 (2014.01); C09D 11/037 (2014.01); C09D 11/322 (2014.01); C22C 9/00 (2006.01); D21H 19/02 (2006.01); D21H 19/06 (2006.01); D21H 19/66 (2006.01)
CPC C09D 11/52 (2013.01) [B41M 5/0023 (2013.01); B41M 7/009 (2013.01); C09D 11/033 (2013.01); C09D 11/037 (2013.01); C09D 11/322 (2013.01); C22C 9/00 (2013.01); D21H 19/02 (2013.01); D21H 19/06 (2013.01); D21H 19/66 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A sinterable conductive coating composition, comprising:
nanowires decorated with capped nanoparticles, each capped nanoparticle comprising an alloy of at least 1% copper and at least 1% gold, nickel, aluminum, zinc or tin, capped with a capping agent comprising at least one of an amine, a thiolate and an acrylate
the decorated nanowires being configured to sinter in a buffer solution on a substrate that desorbs the capping agent at a temperature below 100° C.