US 11,987,701 B2
Thermosetting resin compositions, liquid packaging material, film, semiconductor package, interlayer insulating film, and flame-retardant resin composition
Pi-Tao Kuo, Taipei (TW)
Assigned to CHIN YEE CHEMICAL INDUSTRIES CO., LTD., Taipei (TW)
Filed by CHIN YEE CHEMICAL INDUSTRIES CO., LTD., Taipei (TW)
Filed on Apr. 28, 2021, as Appl. No. 17/243,536.
Claims priority of application No. 110109137 (TW), filed on Mar. 15, 2021.
Prior Publication US 2021/0269641 A1, Sep. 2, 2021
Int. Cl. C08L 79/04 (2006.01); C08K 5/3415 (2006.01); C08K 5/5397 (2006.01); H01L 23/29 (2006.01)
CPC C08L 79/04 (2013.01) [C08K 5/3415 (2013.01); C08K 5/5397 (2013.01); H01L 23/293 (2013.01); C08L 2201/02 (2013.01); C08L 2203/206 (2013.01)] 12 Claims
 
1. A thermosetting resin composition, the composition at least containing:
(a) a benzoxazine resin, comprising:
at least one selected from a group consisting of

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(b) bismaleimide, having a chemical structure as shown in formula (1):

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wherein R is a divalent hydrocarbon group with an aliphatic side chain, and has 36 carbon atoms; n is an integer selected from 0 to 3; a ratio of the benzoxazine resin:the bismaleimide=0.1 to 0.5:1.0.