	US 11,987,687 B2
	Heat conductive sheet
Hiromichi Iwazaki, Kounosu (JP)
Assigned to SEKISUI POLYMATECH CO., LTD., Saitama (JP)
Appl. No. 17/278,420
Filed by SEKISUI POLYMATECH CO., LTD., Saitama (JP)
PCT Filed Sep. 25, 2019, PCT No. PCT/JP2019/037554 § 371(c)(1), (2) Date Mar. 22, 2021, PCT Pub. No. WO2020/067141, PCT Pub. Date Apr. 2, 2020.
Claims priority of application No. 2018-180192 (JP), filed on Sep. 26, 2018.
Prior Publication US 2021/0388175 A1, Dec. 16, 2021
Int. Cl. C08K 7/06 (2006.01); C08K 3/04 (2006.01); C08L 83/04 (2006.01); C08L 101/16 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 7/08 (2006.01)

CPC C08K 3/042 (2017.05) [C08L 83/04 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/2227 (2013.01); C08K 7/06 (2013.01); C08K 7/08 (2013.01); C08K 2201/001 (2013.01)]

8 Claims

1. A thermally conductive sheet comprising an anisotropic filler in a polymer matrix, wherein the anisotropic filler appears on at least one surface of the thermally conductive sheet and the at least one surface has an arithmetic mean peak curvature (Spc) of 18000 (1/mm) or less,

wherein a surface of the thermally conductive sheet has a developed interfacial area ratio (Sdr) of 70 or less.