US 11,987,686 B2
Thermally conductive sheet
Hiroki Kudoh, Kawaguchi (JP); Taku Sasaki, San Jose, CA (US); Kana Hattori, Nishinomiya (JP); Kazuyuki Yahara, Nagaokakyo (JP); and Yasunari Kusaka, Osaka (JP)
Assigned to SEKISUI POLYMATECH CO., LTD., Saitama (JP)
Appl. No. 17/252,957
Filed by SEKISUI POLYMATECH CO., LTD., Saitama (JP)
PCT Filed Jun. 18, 2019, PCT No. PCT/JP2019/024113
§ 371(c)(1), (2) Date Dec. 16, 2020,
PCT Pub. No. WO2019/244890, PCT Pub. Date Dec. 26, 2019.
Claims priority of application No. 2018-119378 (JP), filed on Jun. 22, 2018.
Prior Publication US 2021/0130570 A1, May 6, 2021
Int. Cl. C08K 3/04 (2006.01); C08L 83/04 (2006.01); C08K 3/22 (2006.01); C08K 7/04 (2006.01); C08K 7/18 (2006.01)
CPC C08K 3/04 (2013.01) [C08L 83/04 (2013.01); C08K 2003/2227 (2013.01); C08K 7/04 (2013.01); C08K 7/18 (2013.01); C08K 2201/001 (2013.01); C08K 2201/003 (2013.01); C08K 2201/004 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A thermally conductive sheet comprising:
a polymer matrix; and
an anisotropic filler, the anisotropic filler oriented in a thickness direction,
the anisotropic filler being exposed on a surface of the thermally conductive sheet, and the anisotropic filler which is exposed being disposed in such a way as to fall down in a proportion of 3.5 to 45% of a total number of the exposed anisotropic fillers.