US 11,987,528 B2
Process for hydrophobizing shaped insulation-material bodies based on silica at ambient pressure
Uwe Albinus, Bad Vilbel (DE); Jürgen Meyer, Stockstadt (DE); and Gabriele Gartner, Nidderau (DE)
Assigned to Kingspan Insulation Limited, Leominster (GB)
Appl. No. 17/260,371
Filed by Kingspan Insulation Limited, Leominster (GB)
PCT Filed Jul. 8, 2019, PCT No. PCT/EP2019/068194
§ 371(c)(1), (2) Date Jan. 14, 2021,
PCT Pub. No. WO2020/016036, PCT Pub. Date Jan. 23, 2020.
Claims priority of application No. 18184079 (EP), filed on Jul. 18, 2018.
Prior Publication US 2021/0292238 A1, Sep. 23, 2021
Int. Cl. C04B 30/02 (2006.01); C04B 40/00 (2006.01); C04B 111/52 (2006.01)
CPC C04B 30/02 (2013.01) [C04B 40/0071 (2013.01); C04B 2111/52 (2013.01)] 10 Claims
 
1. A process for producing a hydrophobized shaped thermal-insulation body,
comprising pressing or compacting a thermal-insulation mixture:
wherein the thermal-insulation mixture comprises:
a) 30% to 95% by weight of silica;
b) 5% to 50% of an IR opacifier;
c) 1% to 20% by weight of organosilicon compound A, wherein organosilicon compound A is hexamethyldisilazane (HMDS);
(d) 1% to 20% by weight of organosilicon compound B, wherein organosilicon compound B is a substance of formula RnSiX4-n, wherein:
R=hydrocarbyl radical having 1 to 18 carbon atoms;
n=0, 1 or 2;
X=Cl, Br or alkoxy group —OR1 wherein R1=hydrocarbyl radical having 1 to 8 carbon atoms;
or organosilicon compound B corresponds to a silanol of the formula HO[—Si(CH3)2O—]mH, where m=2-100; and
e) 0.1% to 10% by weight of water;
and wherein the hydrophobized shaped thermal-insulation body formed has a density of
50 to 300 g/l and a compressive strength of 65 to 150 kPa.