CPC C04B 30/02 (2013.01) [C04B 40/0071 (2013.01); C04B 2111/52 (2013.01)] | 10 Claims |
1. A process for producing a hydrophobized shaped thermal-insulation body,
comprising pressing or compacting a thermal-insulation mixture:
wherein the thermal-insulation mixture comprises:
a) 30% to 95% by weight of silica;
b) 5% to 50% of an IR opacifier;
c) 1% to 20% by weight of organosilicon compound A, wherein organosilicon compound A is hexamethyldisilazane (HMDS);
(d) 1% to 20% by weight of organosilicon compound B, wherein organosilicon compound B is a substance of formula RnSiX4-n, wherein:
R=hydrocarbyl radical having 1 to 18 carbon atoms;
n=0, 1 or 2;
X=Cl, Br or alkoxy group —OR1 wherein R1=hydrocarbyl radical having 1 to 8 carbon atoms;
or organosilicon compound B corresponds to a silanol of the formula HO[—Si(CH3)2O—]mH, where m=2-100; and
e) 0.1% to 10% by weight of water;
and wherein the hydrophobized shaped thermal-insulation body formed has a density of
50 to 300 g/l and a compressive strength of 65 to 150 kPa.
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