	US 11,987,528 B2
	Process for hydrophobizing shaped insulation-material bodies based on silica at ambient pressure
Uwe Albinus, Bad Vilbel (DE); Jürgen Meyer, Stockstadt (DE); and Gabriele Gartner, Nidderau (DE)
Assigned to Kingspan Insulation Limited, Leominster (GB)
Appl. No. 17/260,371
Filed by Kingspan Insulation Limited, Leominster (GB)
PCT Filed Jul. 8, 2019, PCT No. PCT/EP2019/068194 § 371(c)(1), (2) Date Jan. 14, 2021, PCT Pub. No. WO2020/016036, PCT Pub. Date Jan. 23, 2020.
Claims priority of application No. 18184079 (EP), filed on Jul. 18, 2018.
Prior Publication US 2021/0292238 A1, Sep. 23, 2021
Int. Cl. C04B 30/02 (2006.01); C04B 40/00 (2006.01); C04B 111/52 (2006.01)

CPC C04B 30/02 (2013.01) [C04B 40/0071 (2013.01); C04B 2111/52 (2013.01)]

10 Claims

1. A process for producing a hydrophobized shaped thermal-insulation body,

comprising pressing or compacting a thermal-insulation mixture:

wherein the thermal-insulation mixture comprises:

a) 30% to 95% by weight of silica;

b) 5% to 50% of an IR opacifier;

c) 1% to 20% by weight of organosilicon compound A, wherein organosilicon compound A is hexamethyldisilazane (HMDS);

(d) 1% to 20% by weight of organosilicon compound B, wherein organosilicon compound B is a substance of formula R_nSiX_4-n, wherein:

R=hydrocarbyl radical having 1 to 18 carbon atoms;

n=0, 1 or 2;

X=Cl, Br or alkoxy group —OR¹wherein R¹=hydrocarbyl radical having 1 to 8 carbon atoms;

or organosilicon compound B corresponds to a silanol of the formula HO[—Si(CH₃)₂O—]_mH, where m=2-100; and

e) 0.1% to 10% by weight of water;

and wherein the hydrophobized shaped thermal-insulation body formed has a density of

50 to 300 g/l and a compressive strength of 65 to 150 kPa.