US 11,987,508 B2
Water treatment system
Matthew J. Norconk, Grand Rapids, MI (US); Ted Robbins, Ada, MI (US); Ziqi Wu, Grand Rapids, MI (US); and Joshua B. Taylor, Rockford, MI (US)
Assigned to Access Business Group International LLC, Ada, MI (US)
Filed by Access Business Group International LLC, Ada, MI (US)
Filed on Jan. 5, 2022, as Appl. No. 17/568,953.
Prior Publication US 2023/0212038 A1, Jul. 6, 2023
Int. Cl. C02F 1/32 (2023.01); C02F 1/02 (2023.01)
CPC C02F 1/325 (2013.01) [C02F 1/02 (2013.01); C02F 2201/002 (2013.01); C02F 2201/3222 (2013.01); C02F 2303/04 (2013.01); C02F 2307/06 (2013.01)] 26 Claims
OG exemplary drawing
 
1. An ultraviolet (UV) reactor for irradiating a flow of water with UV radiation, the UV reactor comprising:
a treatment assembly including a water inlet and a water outlet, the treatment assembly operable to direct water received via the water inlet toward a point-of-use downstream from the water outlet;
a printed circuit board (PCB) including a solder mask, a first substrate, a heat conducting substrate, and a dielectric disposed between the first substrate and the heat conducting substrate, the first substrate including a first surface with a circuit region, the solder mask being disposed on the first surface of the first substrate;
a UV light emitting diode (UV-LED) operatively connected to the PCB, the UV-LED oriented for directing UV energy into the treatment assembly; and
wherein a thermal contact region of the heat conducting substrate is exposed such that the thermal contact region is devoid of the dielectric, the solder mask, and the first substrate, wherein the thermal contact region is in thermal communication with water flowing through the UV reactor, and wherein at least a portion of the UV-LED is disposed on the first surface of the first substrate.