US 11,987,495 B2
MEMS resonator system
Pavan Gupta, Belmont, CA (US); Aaron Partridge, Cupertino, CA (US); and Markus Lutz, Mountain View, CA (US)
Assigned to SiTime Corporation, Santa Clara, CA (US)
Filed by SiTime Corporation, Santa Clara, CA (US)
Filed on Jun. 6, 2023, as Appl. No. 18/206,520.
Application 17/827,437 is a division of application No. 17/143,119, filed on Jan. 6, 2021, granted, now 11,370,656, issued on Jun. 28, 2022.
Application 17/143,119 is a division of application No. 16/903,116, filed on Jun. 16, 2020, granted, now 10,913,655, issued on Feb. 9, 2021.
Application 16/903,116 is a division of application No. 16/372,745, filed on Apr. 2, 2019, granted, now 10,723,617, issued on Jul. 28, 2020.
Application 16/372,745 is a division of application No. 15/805,031, filed on Nov. 6, 2017, granted, now 10,287,162, issued on May 14, 2019.
Application 15/805,031 is a division of application No. 15/187,748, filed on Jun. 20, 2016, granted, now 9,821,998, issued on Nov. 21, 2017.
Application 15/187,748 is a division of application No. 14/597,825, filed on Jan. 15, 2015, granted, now 9,371,221, issued on Jun. 21, 2016.
Application 14/597,825 is a division of application No. 14/191,978, filed on Feb. 27, 2014, granted, now 8,941,247, issued on Jan. 27, 2015.
Application 14/191,978 is a division of application No. 13/681,065, filed on Nov. 19, 2012, granted, now 8,669,664, issued on Mar. 11, 2014.
Application 13/681,065 is a division of application No. 13/151,316, filed on Jun. 2, 2011, granted, now 8,324,729, issued on Dec. 4, 2012.
Application 13/151,316 is a division of application No. 11/763,801, filed on Jun. 15, 2007, granted, now 8,022,554, issued on Sep. 20, 2011.
Application 18/206,520 is a continuation of application No. 17/827,437, filed on May 27, 2022, granted, now 11,708,264.
Claims priority of provisional application 60/813,874, filed on Jun. 15, 2006.
Prior Publication US 2023/0391611 A1, Dec. 7, 2023
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/498 (2006.01); H10N 30/30 (2023.01)
CPC B81B 7/0083 (2013.01) [B81B 7/007 (2013.01); B81B 7/0077 (2013.01); B81C 1/0023 (2013.01); B81C 1/00301 (2013.01); B81C 1/00333 (2013.01); B81C 1/00341 (2013.01); H01L 23/34 (2013.01); H01L 23/498 (2013.01); H10N 30/302 (2023.02); B81B 2201/0271 (2013.01); B81B 2207/07 (2013.01); B81B 2207/094 (2013.01); B81C 2201/016 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/0154 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of fabricating an integrated circuit device, the method comprising:
adhering a lead frame to a tape, the lead frame providing for one or more external electrical contacts and one or more internal electrical contacts, and for electrical interconnection between the one or more external electrical contacts and corresponding ones of the one or more internal electrical contacts;
physically mounting each of a first chip having a microelectromechanical systems (MEMS) resonator, and a control chip, with respect to the tape and the lead frame, wherein physically mounting comprises electrically connecting contacts of the first chip with first contacts of the control chip and electrically connecting second contacts of the control chip with the internal electrical contacts; and
depositing a mold compound to mechanically support the first chip relative to the control chip and in a manner that encases at least one side of the first chip;
wherein the tape is adapted from removal from the lead frame, in a manner that renders the one or more external electrical contacts exposed to the external atmospheric environment; and
wherein the one or more external electrical contacts are to provide an electrical output of the integrated circuit device which is dependent on operation of the MEMS resonator.