US 11,987,493 B2
Damascene interconnect structure, actuator device, and method of manufacturing damascene interconnect structure
Daiki Suzuki, Hamamatsu (JP); Nao Inoue, Hamamatsu (JP); and Katsumi Shibayama, Hamamatsu (JP)
Assigned to HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
Appl. No. 17/288,250
Filed by HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
PCT Filed Oct. 30, 2019, PCT No. PCT/JP2019/042669
§ 371(c)(1), (2) Date Apr. 23, 2021,
PCT Pub. No. WO2020/090931, PCT Pub. Date May 7, 2020.
Claims priority of application No. 2018-205351 (JP), filed on Oct. 31, 2018.
Prior Publication US 2021/0387852 A1, Dec. 16, 2021
Int. Cl. G02B 26/08 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01)
CPC B81B 3/0072 (2013.01) [B81C 1/00666 (2013.01); G02B 26/0833 (2013.01); B81B 2201/042 (2013.01); B81B 2207/07 (2013.01); B81C 2201/0104 (2013.01); B81C 2201/0181 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A damascene wiring structure comprising:
a base including a main surface provided with a groove;
an insulating layer including a first portion provided on an inner surface of the groove and a second portion formed integrally with the first portion and provided on the main surface;
a metal layer provided on the first portion of the insulating layer;
a wiring portion embedded in the groove and joined to the metal layer; and
a cap layer provided to cover the second portion of the insulating layer, an end portion of the metal layer, and the wiring portion,
wherein a surface of a boundary part between the first portion and the second portion in the insulating layer on a side opposite to the base includes an inclined surface inclined with respect to a direction perpendicular to the main surface when viewed from an extending direction of the wiring portion, and
the end portion of the metal layer enters between the cap layer and the inclined surface, and in the end portion, a first surface along the cap layer and a second surface along the inclined surface form an acute angle.