US 11,987,408 B2
Component mounting system and tape scraps collecting device
Hiroki Kobayashi, Fukuoka (JP); Naoki Azuma, Osaka (JP); Chikara Takata, Fukuoka (JP); Yuzo Asano, Fukuoka (JP); Toru Chikuma, Fukuoka (JP); and Hiroshi Satoh, Fukuoka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Jun. 22, 2023, as Appl. No. 18/339,403.
Application 18/339,403 is a continuation of application No. 18/150,874, filed on Jan. 6, 2023, granted, now 11,724,842.
Application 18/150,874 is a continuation of application No. 17/647,196, filed on Jan. 6, 2022, granted, now 11,584,552, issued on Feb. 21, 2023.
Application 17/647,196 is a continuation of application No. 16/930,458, filed on Jul. 16, 2020, granted, now 11,254,456, issued on Feb. 22, 2022.
Application 16/930,458 is a continuation of application No. PCT/JP2019/003293, filed on Jan. 31, 2019.
Claims priority of application No. 2018-079725 (JP), filed on Apr. 18, 2018; and application No. 2018-079726 (JP), filed on Apr. 18, 2018.
Prior Publication US 2023/0331413 A1, Oct. 19, 2023
Int. Cl. B65B 15/04 (2006.01); B65G 47/68 (2006.01); H05K 13/02 (2006.01); H05K 13/04 (2006.01)
CPC B65B 15/04 (2013.01) [B65G 47/68 (2013.01); H05K 13/02 (2013.01); H05K 13/0417 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A component mounting system comprising:
a component mounting device group including a plurality of component mounting devices, the plurality of component mounting devices being arranged on a floor surface in a direction of conveying a board, the component mounting device group defining a space under the component mounting device group, each of the plurality of component mounting devices being configured to:
mount a component supplied by a tape feeder from a carrier tape onto the board conveyed from an upstream side; and
cut the carrier tape by a cutter device after supplying the component from the carrier tape to the board; and
discharge scraps of the carrier tape;
a main conveyor installed along the arrangement of the plurality of component mounting devices, wherein the main conveyor is installed under the component mounting device group, the main conveyor being configured to convey the scraps discharged from the carrier tape;
a disposing conveyor connected to the main conveyor, the disposing conveyor being configured to be inclined in the direction of the slope from an upstream side to a downstream side in the conveying direction;
a scraps storage installed outside the space, the scraps storage being configured to store the scraps conveyed by the disposing conveyor.