US 11,987,184 B2
Vehicle-mounted camera
Toshihiro Tokito, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/289,189
Filed by Sony Semiconductor Solutions Corporation, Kanagawa (JP)
PCT Filed Nov. 8, 2019, PCT No. PCT/JP2019/043876
§ 371(c)(1), (2) Date Apr. 27, 2021,
PCT Pub. No. WO2020/100740, PCT Pub. Date May 22, 2020.
Claims priority of application No. 2018-214503 (JP), filed on Nov. 15, 2018.
Prior Publication US 2022/0009425 A1, Jan. 13, 2022
Int. Cl. B60R 11/04 (2006.01); H04N 23/57 (2023.01); H05K 1/11 (2006.01)
CPC B60R 11/04 (2013.01) [H04N 23/57 (2023.01); H05K 1/118 (2013.01); B60R 2300/10 (2013.01); B60R 2300/30 (2013.01); H05K 2201/10151 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A vehicle-mounted camera, comprising:
an imaging device board including a first terminal;
a main board including a second terminal; and
a flexible board including
a first connection portion to be connected to the first terminal,
a second connection portion to be connected to the second terminal, and
a first bending portion located adjacent to the first connection portion and between the first connection portion and the second connection portion and a second bending portion located adjacent to the second connection portion and between the first connection portion and the second connection portion, wherein the first bending portion is bent along a first bending axis and the second bending portion is bent along a second bending axis, and the first bending axis and the second bending axis intersect each other at an angle.