US 11,987,052 B2
Photoimageable nozzle plate having increased solvent resistance
David C. Graham, Lexington, KY (US); and Sean T. Weaver, Lexington, KY (US)
Assigned to FUNAI ELECTRIC CO., LTD, (JP)
Filed by FUNAI ELECTRIC CO., LTD, Osaka (JP)
Filed on May 11, 2022, as Appl. No. 17/662,861.
Prior Publication US 2023/0364908 A1, Nov. 16, 2023
Int. Cl. B41J 2/14 (2006.01); B41J 2/145 (2006.01); B41J 2/16 (2006.01); B41J 2/175 (2006.01)
CPC B41J 2/1433 (2013.01) [B41J 2/145 (2013.01); B41J 2/162 (2013.01); B41J 2/175 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A nozzle plate of a fluid jet ejection head for a fluid ejection device, the nozzle plate being configured to attach to an underlying flow feature layer wherein the nozzle plate comprises at least two arrays of nozzle holes on opposing sides of a fluid supply via etched in an ejection head substrate and a photoresist layer attached to an exposed surface of the nozzle plate opposite to the underlying flow feature layer, the photoresist layer spanning a section of the nozzle plate between the at least two arrays of nozzle holes, wherein the photoresist layer is configured to increase a thickness of the nozzle plate between the at least two arrays of nozzle holes to greater than 25 microns up to about 100 microns.