US 11,987,033 B2
System and method of dielectric bonding
Hugh Foran, Auburn Hills, MI (US); Noriyuki Amano, Auburn Hills, MI (US); and Joshua Dech, Auburn Hills, MI (US)
Assigned to Teijin Automotive Technologies, Inc., Auburn Hills, MI (US)
Filed by Teijin Automotive Technologies, Inc., Auburn Hills, MI (US)
Filed on Aug. 26, 2022, as Appl. No. 17/896,314.
Claims priority of provisional application 63/237,194, filed on Aug. 26, 2021.
Prior Publication US 2023/0074158 A1, Mar. 9, 2023
Int. Cl. B32B 37/06 (2006.01); B32B 5/02 (2006.01); B32B 7/12 (2006.01); B32B 15/14 (2006.01); B32B 37/08 (2006.01); B32B 37/12 (2006.01); B62D 29/00 (2006.01)
CPC B32B 37/06 (2013.01) [B32B 5/02 (2013.01); B32B 7/12 (2013.01); B32B 15/14 (2013.01); B32B 37/08 (2013.01); B32B 37/12 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2305/022 (2013.01); B32B 2305/08 (2013.01); B32B 2305/77 (2013.01); B32B 2309/04 (2013.01); B32B 2310/0868 (2013.01); B32B 2605/08 (2013.01); B62D 29/00 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A system for dielectric bonding, the system comprising:
a dielectric heater having a pair of opposing electrode plates;
a nest removably coupled to a first electrode plate of the pair of electrode plates, the nest being configured to support a material assembly, the nest having a plurality of first cooling channels defined in a body thereof, the first cooling channels configured to circulate a first cooling fluid therein to cool the material assembly;
an interchangeable electrode assembly removably coupled to a second electrode plate of the pair of electrode plates, the electrode assembly having a plurality of concentrator members, each of the concentrator members having a second cooling channel defined in a body thereof to circulate a second cooling fluid therein to cool the material assembly after bonding, the plurality of concentrator members configured to concentrate energy from a voltage source in predetermined locations on the material assembly.