US 11,987,016 B2
Molding device for casting an optical article with wafer on top, corresponding method and optical article
Pascal Soave, Charenton-le-Pont (FR); Michel Matz, Charenton-le-Pont (FR); and Carlos Gonzalez, Dallas, TX (US)
Assigned to Essilor International, Charenton-le-Pont (FR)
Appl. No. 17/259,008
Filed by ESSILOR INTERNATIONAL, Charenton-le-Pont (FR)
PCT Filed Jul. 11, 2019, PCT No. PCT/EP2019/068745
§ 371(c)(1), (2) Date Jan. 8, 2021,
PCT Pub. No. WO2020/011946, PCT Pub. Date Jan. 16, 2020.
Claims priority of application No. 18183220 (EP), filed on Jul. 12, 2018.
Prior Publication US 2021/0268755 A1, Sep. 2, 2021
Int. Cl. B29D 11/00 (2006.01); B29C 70/78 (2006.01)
CPC B29D 11/00528 (2013.01) [B29C 70/78 (2013.01); B29D 11/00413 (2013.01); B29D 11/00634 (2013.01); B29D 11/0073 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A molding device for casting an optical article with a thermoset resin, the optical article defining two opposed main surfaces, one of which being formed by an optical functional wafer, the molding device comprising:
a) a molding element forming a rear or a front part of a casting mold;
b) a gasket intended to surround the periphery of the molding element;
c) an initially curved wafer defining a predetermined curvature depending on one of the two main surfaces of the optical article to be manufactured;
d) a closing element defining in a closing position in which the peripheral part of the wafer on the gasket is pinched, a pouring space between the molding element, the gasket and the wafer; and
e) spacing means interposed between the wafer and the closing element to define an internal volume between the wafer and the closing element, the spacing means, wafer and closing element being configured to form a set hermetic to the resin to be poured into the molding device when the closing member occupies a closing position.