US 11,987,015 B2
Systems and methods for evacuated injection repair of bondline voids
Joseph L. Hafenrichter, Chicago, IL (US); Gary E. Georgeson, Chicago, IL (US); and Marc J. Piehl, Chicago, IL (US)
Assigned to The Boeing Company, Arlington, VA (US)
Filed by The Boeing Company, Chicago, IL (US)
Filed on Dec. 15, 2021, as Appl. No. 17/551,320.
Claims priority of provisional application 63/126,914, filed on Dec. 17, 2020.
Prior Publication US 2022/0194031 A1, Jun. 23, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B29C 73/02 (2006.01); B29C 73/24 (2006.01); B29L 31/30 (2006.01)
CPC B29C 73/025 (2013.01) [B29C 73/24 (2013.01); B29L 2031/3085 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
forming a single hole into a bond gap repair area;
evacuating, via an adhesive injection apparatus attached to the single hole, the bond gap repair area and an injection channel of the adhesive injection apparatus; and
forcing adhesive through the evacuated injection channel and into the evacuated bond gap repair area.