US 11,986,978 B2
Substrate processing apparatus
Hiroyoshi Mori, Namerikawa (JP)
Assigned to M-DIA & CO., LTD., Namerikawa (JP)
Filed by M-DIA & Co., Ltd., Namerikawa (JP)
Filed on Nov. 10, 2021, as Appl. No. 17/523,118.
Application 17/523,118 is a continuation of application No. PCT/JP2020/045691, filed on Dec. 8, 2020.
Claims priority of application No. 2020-022738 (JP), filed on Feb. 13, 2020.
Prior Publication US 2022/0063139 A1, Mar. 3, 2022
Int. Cl. B29B 17/02 (2006.01); B29K 23/00 (2006.01); B29K 705/00 (2006.01)
CPC B29B 17/02 (2013.01) [B29B 2017/0203 (2013.01); B29B 2017/0217 (2013.01); B29K 2023/12 (2013.01); B29K 2705/00 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate processing apparatus for separating an electronic component from a substrate with the electronic component attached to an upper surface of the substrate, the substrate processing apparatus comprising:
an upper surface processing device configured to separate the electronic component from the upper surface of the substrate, wherein
the upper surface processing device comprises an upper surface processing transporter configured to transport the substrate from an upstream side to a downstream side and an upper surface rotary blade configured to separate the electronic component from the upper surface of the substrate,
the upper surface processing transporter comprises a sixth belt conveyor on the upstream side and a seventh belt conveyor on the downstream side, the sixth and seventh belt conveyors being located below the upper surface rotary blade and aligned in a transport direction, the upper surface rotary blade has a downstream portion facing a gap between the sixth belt conveyor and the seventh belt conveyor, and the sixth belt conveyor has a downstream end extending to the lower side of the upper surface rotary blade in the transport direction.