CPC B24B 57/02 (2013.01) [B24B 37/10 (2013.01); H01L 21/67075 (2013.01); H01L 21/6708 (2013.01)] | 18 Claims |
1. An apparatus for chemical mechanical polishing, comprising:
a rotatable platen having a surface to support a polishing pad;
a carrier head to hold a substrate in contact with the polishing pad; and
a polishing liquid distribution system, the polishing liquid distribution system including
a dispenser positioned to deliver a polishing liquid at a dispensing position onto a polishing surface of the polishing pad, and
a first barrier including a first solid body having a first leading surface and a first flat bottom surface, the first flat bottom surface positioned to contact the polishing surface, the first barrier located after the dispensing position to spread fresh polishing liquid delivered by the dispenser onto the polishing surface, the first leading surface being orthogonal to the polishing surface, and wherein the first leading surface of the first barrier curves about an axis perpendicular to the polishing surface such that a convex curvature along a length of the first leading surface of the first barrier faces the dispenser.
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