US 11,986,926 B2
Slurry distribution device for chemical mechanical polishing
Yen-Chu Yang, Santa Clara, CA (US); Stephen Jew, San Jose, CA (US); Jianshe Tang, San Jose, CA (US); Haosheng Wu, San Jose, CA (US); Shou-Sung Chang, Mountain View, CA (US); Paul D. Butterfield, San Jose, CA (US); Alexander John Fisher, Santa Clara, CA (US); and Bum Jick Kim, Irvine, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Aug. 26, 2022, as Appl. No. 17/897,088.
Application 17/897,088 is a continuation of application No. 17/209,034, filed on Mar. 22, 2021, granted, now 11,806,835.
Application 17/209,034 is a continuation of application No. 15/626,857, filed on Jun. 19, 2017, granted, now 10,967,483, issued on Apr. 6, 2021.
Claims priority of provisional application 62/510,532, filed on May 24, 2017.
Claims priority of provisional application 62/354,563, filed on Jun. 24, 2016.
Prior Publication US 2022/0402096 A1, Dec. 22, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B24B 57/02 (2006.01); B24B 37/10 (2012.01); H01L 21/67 (2006.01)
CPC B24B 57/02 (2013.01) [B24B 37/10 (2013.01); H01L 21/67075 (2013.01); H01L 21/6708 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus for chemical mechanical polishing, comprising:
a rotatable platen having a surface to support a polishing pad;
a carrier head to hold a substrate in contact with the polishing pad; and
a polishing liquid distribution system, the polishing liquid distribution system including
a dispenser positioned to deliver a polishing liquid at a dispensing position onto a polishing surface of the polishing pad, and
a first barrier including a first solid body having a first leading surface and a first flat bottom surface, the first flat bottom surface positioned to contact the polishing surface, the first barrier located after the dispensing position to spread fresh polishing liquid delivered by the dispenser onto the polishing surface, the first leading surface being orthogonal to the polishing surface, and wherein the first leading surface of the first barrier curves about an axis perpendicular to the polishing surface such that a convex curvature along a length of the first leading surface of the first barrier faces the dispenser.