CPC B23K 26/38 (2013.01) [H01M 10/0404 (2013.01)] | 14 Claims |
1. A die-cutting device, comprising:
a conveying mechanism configured to convey an electrode plate that comprises an uncoated region and a coated region, the uncoated region being connected to the coated region;
a first cutting mechanism located on one side of the electrode plate in a thickness direction and configured to cut the uncoated region such that the uncoated region forms a scrap portion connected to the coated region and a tab connected to the coated region and separated from the scrap portion;
a second cutting mechanism disposed on one side of the electrode plate in the thickness direction, disposed downstream of the first cutting mechanism, and configured to cut the scrap portion to separate the scrap portion from the coated region;
a first limiting member located between the electrode plate and the first cutting mechanism in the thickness direction and provided with a cutting hole that allows laser light emitted by the first cutting mechanism to pass through, the cutting hole matching a cutting trajectory of the laser light;
a second limiting member located on a side of the electrode plate that faces away from the first limiting member in the thickness direction, and configured to cooperate with the first limiting member to limit the electrode plate in the thickness direction; and
a guide mechanism disposed downstream of the first limiting member and configured to drive the scrap portion to offset towards the second cutting mechanism.
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