US 11,986,905 B2
Diamond smoothing method
Hiroshi Ikenoue, Fukuoka (JP); Tsuyoshi Yoshitake, Fukuoka (JP); Yuki Katamune, Kitakyushu (JP); and Koki Murasawa, Toyokawa (JP)
Assigned to KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, Fukuoka (JP); KYUSHU INSTITUTE OF TECHNOLOGY, Kitakyushu (JP); and OSG CORPORATION, Toyokawa (JP)
Appl. No. 17/263,650
Filed by KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, Fukuoka (JP); KYUSHU INSTITUTE OF TECHNOLOGY, Kitakyushu (JP); and OSG CORPORATION, Toyokawa (JP)
PCT Filed Aug. 1, 2018, PCT No. PCT/JP2018/028944
§ 371(c)(1), (2) Date Jan. 27, 2021,
PCT Pub. No. WO2020/026393, PCT Pub. Date Feb. 6, 2020.
Prior Publication US 2021/0299787 A1, Sep. 30, 2021
Int. Cl. C30B 29/00 (2006.01); B23K 26/00 (2014.01); B23K 26/03 (2006.01); B23K 26/352 (2014.01); B23K 33/00 (2006.01); C30B 29/04 (2006.01); C30B 33/00 (2006.01); C30B 33/04 (2006.01); B23K 103/00 (2006.01)
CPC B23K 26/3576 (2018.08) [B23K 26/0006 (2013.01); B23K 26/03 (2013.01); C30B 29/04 (2013.01); C30B 33/04 (2013.01); B23K 2103/50 (2018.08)] 11 Claims
OG exemplary drawing
 
1. A diamond smoothing method comprising: a threshold-energy-density detecting step of detecting a threshold energy density as a lower threshold value of an irradiation energy density of a laser light that causes ablation to occur, by irradiating the laser light onto a raised and recessed surface of a diamond, and changing an irradiation energy density of the laser light; and a smoothing processing step of executing a smoothing processing by irradiating the laser light onto the raised and recessed surface with a smoothing irradiation energy density that is set to be within a range from 1 to 15 times as large as the threshold energy density, wherein, at the smoothing processing step, the smoothing processing is executed such that a sum of a polished amount of the diamond from bottoms of recessed portions of the raised and recessed surface and a thickness of an affected layer of a polished surface after the smoothing processing, becomes 2.0 m or less, and such that a surface roughness Ra of the polished surface becomes 0.2 m or less, wherein the crystal grain size is 3.0 m or less and the surface roughness Ra is 1.0 m or less before the smoothing processing.