US 11,986,899 B2
Soldering apparatus
Lothar Endreß, Wertheim (DE); Benedict Fleischmann, Neubrunn (DE); and Lukas Thanhäuser, Würzburg (DE)
Assigned to ERSA GmbH, Wertheim (DE)
Filed by ERSA GmbH, Wertheim (DE)
Filed on Nov. 9, 2022, as Appl. No. 17/983,447.
Claims priority of application No. 10 2021 129 131.3 (DE), filed on Nov. 9, 2021.
Prior Publication US 2023/0141430 A1, May 11, 2023
Int. Cl. B23K 1/00 (2006.01); B23K 1/012 (2006.01); H05K 3/34 (2006.01)
CPC B23K 1/012 (2013.01) [H05K 3/3494 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A soldering apparatus for continuous soldering of printed circuit boards along a transport direction, comprising:
a process channel that comprises a preheating zone, a soldering zone and a cooling zone,
a base body and a cover hood, which can be displaced between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air channels carrying the process gas, filter elements and cooling elements are provided in the base body, wherein at least one fan unit is arranged in or on the base body laterally next to the process channel in the transport direction and below the process channel,
wherein the at least one fan unit comprises a fan motor, a rotor shaft and a fan wheel provided on the rotor shaft, wherein the rotor shaft is arranged in a manner running in a vertical direction, laterally next to the process channel, wherein the fan motor is arranged vertically above the fan wheel,
wherein air channels are arranged and provided in such a manner that, during operation of the at least one fan unit, process gas is blown laterally below the process channel and is deflected there vertically upwards into the process channel, wherein the process gas is directed through a filter element provided in a filter region after passing through the process channel, wherein the filtered process gas is drawn in by the at least one fan unit.