US 11,986,882 B2
System and method of 3D printing
Nick Pan, Erwinna, PA (US)
Assigned to PANAM 3D LLC, Erwinna, PA (US)
Filed by PANAM 3D LLC, Erwinna, PA (US)
Filed on Apr. 26, 2023, as Appl. No. 18/139,398.
Application 18/139,398 is a continuation of application No. PCT/US2022/023647, filed on Apr. 6, 2022.
Application PCT/US2022/023647 is a continuation of application No. 17/223,580, filed on Apr. 6, 2021, abandoned.
Prior Publication US 2023/0256516 A1, Aug. 17, 2023
Int. Cl. B22F 12/30 (2021.01); B22F 10/28 (2021.01); B22F 12/88 (2021.01); B29C 64/153 (2017.01); B29C 64/245 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01)
CPC B22F 12/30 (2021.01) [B22F 10/28 (2021.01); B22F 12/88 (2021.01); B29C 64/153 (2017.08); B29C 64/245 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12)] 21 Claims
OG exemplary drawing
 
1. An apparatus for fabricating a three-dimensional structure from a representation of the structure stored in memory, the apparatus comprising:
a build platform having an upper surface and a lower surface with a build gap defined through the build platform from the upper surface to the lower surface;
a base plate initially supported along the lower surface of the build platform such that an edge of the base plate extends along and closes off the build gap;
a powder delivery assembly configured to supply powder to the build gap;
at least one directed energy source positioned above the build platform, the at least one directed energy source configured to apply directed energy to at least a portion of the build gap to form a layer of the three-dimensional structure; and
an advancement assembly positioned below the lower surface of the build platform, the advancement assembly is configured to selectively engage with the base plate and/or the three-dimensional structure to hold the base plate and the three-dimensional structure in a fixed position during forming of the layer and to advance the base plate and the three-dimensional structure further below the lower surface of the build platform once the layer is formed, wherein after advancement over a first given distance, the advancement assembly directly engages the three-dimensional structure.