US 11,986,869 B2
Method of cleaning, support, and cleaning apparatus
Yi Chen Ho, Taichung (TW); Chih Ping Liao, Hsinchu (TW); Ker-hsun Liao, Hsinchu (TW); and Chi-Hsun Lin, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Jun. 6, 2022, as Appl. No. 17/833,814.
Prior Publication US 2023/0390813 A1, Dec. 7, 2023
Int. Cl. B08B 9/032 (2006.01); B08B 13/00 (2006.01)
CPC B08B 9/0321 (2013.01) [B08B 13/00 (2013.01); B08B 2209/032 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of cleaning, comprising:
placing a semiconductor device manufacturing tool component made of quartz on a support, wherein the support comprises an annular base and a plurality of vertically extending members arranged on the annular base, wherein each vertically extending member includes a horizontally extending shelf;
attaching a cleaning fluid inlet line to a first open-ended tubular quartz projection extending from an outer main surface of the semiconductor device manufacturing tool component,
wherein the first open-ended tubular quartz projection includes a ground glass ball joint at an outer end of the tubular quartz projection; and
cleaning the semiconductor device manufacturing tool component by applying a cleaning fluid to the semiconductor device manufacturing tool component by introducing the cleaning fluid through the cleaning fluid inlet line and the first open-ended tubular quartz projection.