CPC B08B 7/0035 (2013.01) [B08B 3/08 (2013.01); B08B 5/02 (2013.01); B08B 7/0021 (2013.01); B08B 7/04 (2013.01); H01J 37/32348 (2013.01); H01J 37/3244 (2013.01); H01J 37/32568 (2013.01); H01J 37/32715 (2013.01); H01L 21/02057 (2013.01); H01L 21/6704 (2013.01); H01J 2237/20214 (2013.01)] | 8 Claims |
1. A substrate processing method comprising:
a process of forming a liquid film of a processing liquid containing at least one of sulfuric acid, a sulfate, peroxosulfuric acid, and a peroxosulfate, or a processing liquid containing hydrogen peroxide on a substrate; and
a process of radiating a plasma to the liquid film formed on the substrate,
wherein the process of radiating the plasma comprises a process of processing the substrate by radicals generated in the liquid film due to a radiation of the plasma to the liquid film,
wherein during the process of radiating the plasma, the liquid film of the processing liquid is maintained to cover an entire surface of the substrate with a thickness in a range of 0.3 to 2.0 mm, and
wherein the process of radiating the plasma includes a process of keeping an atmosphere in the plasma static.
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8. A substrate processing method comprising:
a process of forming a liquid film of a processing liquid containing at least one of sulfuric acid, a sulfate, peroxosulfuric acid, and a peroxosulfate, or a processing liquid containing hydrogen peroxide on a substrate; and
a process of radiating a plasma to the liquid film formed on the substrate,
wherein the process of radiating the plasma comprises a process of processing the substrate by radicals generated in the liquid film due to a radiation of the plasma to the liquid film, and
wherein the process of radiating the plasma includes a process of keeping an atmosphere in the plasma static.
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