CPC B05D 1/005 (2013.01) [B05C 11/08 (2013.01); B05C 11/10 (2013.01); B05C 11/1039 (2013.01); B05D 1/36 (2013.01); B05D 3/007 (2013.01); C23F 1/00 (2013.01); C23F 1/08 (2013.01); H01L 21/67051 (2013.01); H01L 21/6708 (2013.01); H01L 21/67167 (2013.01); H01L 21/67173 (2013.01); H01L 21/67178 (2013.01); H01L 21/67742 (2013.01); H01L 21/68707 (2013.01)] | 11 Claims |
1. A film formation method comprising:
holding and rotating a substrate in a horizontal attitude by a rotation holder;
discharging a coating liquid containing metal as a metal-containing coating liquid to a surface to be processed of the substrate rotated by the rotation holder using a coating liquid nozzle; and
supplying a liquid for dissolving the metal-containing coating liquid to a peripheral portion of the surface to be processed of the substrate rotated by the rotation holder using a peripheral portion removal liquid supply unit such that a metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate,
wherein the liquid for dissolving the metal-containing coating liquid includes an aqueous solution containing tetra methyl ammonium hydroxide or an aqueous solution containing a chelate agent as a first removal liquid.
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11. A film formation method comprising:
holding and rotating a substrate in a horizontal attitude by a rotation holder;
discharging a coating liquid containing metal as a metal-containing coating liquid to a surface to be processed of the substrate rotated by the rotation holder using a coating liquid nozzle;
discharging a second removal liquid for dissolving the coating liquid to a peripheral portion of the surface to be processed of the rotated substrate from a second removal liquid nozzle; and
discharging a first removal liquid for dissolving the metal to the peripheral portion of the surface to be processed of the rotated substrate from a first removal liquid nozzle such that a metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate after the coating liquid on the peripheral portion to be processed of the substrate is dissolved by the second removal liquid.
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