CPC B01F 23/235 (2022.01) [B05B 12/006 (2013.01); B05B 12/10 (2013.01); B29C 44/348 (2013.01); B29C 44/60 (2013.01); B01F 25/62 (2022.01); B05B 7/0025 (2013.01); B29C 44/3442 (2013.01); B29C 44/461 (2013.01); G01F 15/02 (2013.01)] | 20 Claims |
1. A dispensing system to dispense a hot melt adhesive foam onto a substrate, the dispensing system comprising:
a pump having a first input configured to receive a hot melt adhesive and a second input configured to receive a gas, wherein the pump is configured to mix the hot melt adhesive and the gas to produce a solution;
a temperature sensor configured to detect a temperature of the solution;
a dispenser configured to receive the solution from the pump and dispense the solution to create the hot melt adhesive foam; and
a controller in signal communication with the temperature sensor and the pump, wherein the controller is configured to 1) instruct the pump to operate at a first speed; 2) receive a signal from the temperature sensor that is indicative of the temperature of the solution; and 3) instruct the pump to operate at a second speed that is different than the first speed in response to the signal.
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