| CPC A61B 1/0008 (2013.01) [A61B 1/05 (2013.01); A61B 1/0684 (2013.01)] | 22 Claims |
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1. A packaged image sensor, comprising:
a substrate, including a plurality of first electric-conduction contacts, a plurality of second electric-conduction contacts, and a plurality of third electric-conduction contacts, wherein the plurality of second electric-conduction contacts and the plurality of third electric-conduction contacts are electrically connected with the plurality of corresponding first electric-conduction contacts;
an image sensor, disposed on the substrate and electrically connected with the plurality of second electric-conduction contacts;
a light-emitting element, disposed on the substrate and near the image sensor and electrically connected with the plurality of third electric-conduction contacts;
a first encapsulant, filled into a space between the image sensor and the light-emitting element;
a circuit board, including a plurality of fourth electric-conduction contacts and a plurality of fifth electric-conduction contacts, wherein the plurality of fourth electric-conduction contacts is electrically connected with the plurality of corresponding first electric-conduction contacts of the substrate;
a plurality of conductive wires, electrically connected with the plurality of corresponding fifth electric-conduction contacts;
a first pipe, wherein an end of an opening of the first pipe faces a sensing direction of the image sensor and is arranged beside the substrate; and
a second encapsulant, encapsulating the substrate, the circuit board, one end of the plurality of conductive wires and a portion of the first pipe, and keeping two ends of the first pipe opened.
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