US 11,659,776 B2
High temperature-superconducting wire having superconducting layer staked thereon and method for manufacturing same
Hong Soo Ha, Changwon-si (KR); Sang Soo Oh, Gimhae-si (KR); and Sung Kyu Kim, Gyeongsangnam-do (KR)
Assigned to Korea Electrotechnology Research Institute
Filed by Korea Electrotechnology Research Institute, Changwon-si (KR)
Filed on Jun. 2, 2020, as Appl. No. 16/890,011.
Application 16/890,011 is a continuation of application No. PCT/KR2019/003127, filed on Mar. 19, 2019.
Claims priority of application No. 10-2018-0041360 (KR), filed on Apr. 10, 2018.
Prior Publication US 2020/0313064 A1, Oct. 1, 2020
Int. Cl. H01B 12/06 (2006.01); H01F 6/06 (2006.01)
CPC H10N 60/0632 (2023.02) [H01B 12/06 (2013.01); H01F 6/06 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of manufacturing a high temperature-superconducting wire having a superconducting layer laminated thereon, the method comprising;
preparing a first superconducting wire which includes a first metal substrate, a first buffer layer, a first superconducting layer, and a first protective layer;
preparing a second superconducting wire which includes a second metal substrate, a second buffer layer, a second superconducting layer, and a second protective layer;
laminating the first and the second superconducting wires by arranging the first and the second superconducting wires so that the first and the second protective layers face each other and then winding the first and the second superconducting wires on a winding bobbin while applying tension thereto, wherein the first and the second superconducting wires are continuously pressurized by winding;
performing thermal treatment to the first superconducting wire and the second superconducting wire at a temperature between 400 to 600° C. so that the first protective layer and the second protective layer are diffused and joined together to form a single protective layer in which no interface exists;
exfoliating the second metal substrate and the second buffer layer from the second superconducting layer to expose the second superconducting layer;
forming a third protective layer on an exposed surface of the second superconducting layer to form an intermediate superconducting wire;
laminating a third superconducting wire that includes a third metal substrate, a third buffer layer, a third superconducting layer and a fourth protective layer such that the third and the fourth protective layers face each other and then winding the intermediate superconducting wire and the third superconducting wire on a winding bobbin while applying tension thereto, wherein the intermediate superconducting wire and the third superconducting wire are continuously pressurized by winding; and
performing thermal treatment to the intermediate superconducting wire and the third superconducting wire at a temperature between 400 to 600° C. so that the third protective layer and the fourth protective layer are diffused and joined together to form a single protective layer in which no interface exists,
wherein the buffer layers and the superconducting layers have a biaxially textured structure, in which the degree of in-plane orientation orientation (ΔΦ) is 2°<ΔΦ<10°, and the degree of out-of-plane orientation (Δω) is 1°<Δω<7°.