US 11,659,767 B2
Package with built-in thermoelectric element
Masahiro Ogawa, Nagoya (JP); Tetsuya Kato, Nagoya (JP); and Takayuki Hachida, Tokyo (JP)
Assigned to NGK SPARK PLUG CO., LTD., Nagoya (JP); and FERROTEC MATERIAL TECHNOLOGIES CORPORATION, Tokyo (JP)
Appl. No. 16/485,729
Filed by NGK SPARK PLUG CO., LTD., Nagoya (JP); and FERROTEC MATERIAL TECHNOLOGIES CORPORATION, Tokyo (JP)
PCT Filed Feb. 14, 2018, PCT No. PCT/JP2018/005139
§ 371(c)(1), (2) Date Aug. 13, 2019,
PCT Pub. No. WO2018/151176, PCT Pub. Date Aug. 23, 2018.
Claims priority of application No. JP2017-026439 (JP), filed on Feb. 15, 2017.
Prior Publication US 2020/0006617 A1, Jan. 2, 2020
Int. Cl. H10N 10/17 (2023.01); H10N 10/82 (2023.01); H10N 10/817 (2023.01)
CPC H10N 10/17 (2023.02) [H10N 10/817 (2023.02); H10N 10/82 (2023.02)] 7 Claims
OG exemplary drawing
 
1. A thermoelectric element-containing package comprising
a thermoelectric conversion module including:
a first substrate that has a first main surface and a second main surface opposite to the first main surface and is formed of an insulating material;
a second substrate that has a third main surface and a fourth main surface opposite to the third main surface and is formed of an insulating material, the second substrate being disposed such that the third main surface faces the second main surface; and
a plurality of thermoelectric elements that are sandwiched between the first substrate and the second substrate and arranged along the second main surface and the third main surface,
wherein the thermoelectric element-containing package further comprises:
a frame that is joined to the first substrate and the second substrate so as to form a hermetically sealed space surrounding the plurality of thermoelectric elements between the first substrate and the second substrate; and
a placement member that is disposed on the first main surface of the first substrate and to which an additional device is to be electrically connected and the additional device is an electric part or an electric apparatus;
wherein the first substrate includes:
an inner conductive trace that is disposed on the second main surface and connected to the thermoelectric elements,
an outer conductive trace that is disposed on the first main surface and exposed to the outside,
an embedded conductive trace that is connected to the outer conductive trace, and
a first via conductor that penetrates the first substrate so as to extend between the inner conductive trace and the embedded conductive trace, the first via conductor electrically connecting the inner conductive trace to the embedded conductive trace;
wherein the first substrate is comprised of multiple layers and the placement member is disposed on a different layer of the first substrate than the outer conductive trace;
wherein the embedded conductive trace is partially embedded in the first substrate and is disposed on the same surface of the same layer of the first substrate as the outer conductive trace;
wherein the material of the frame is an iron-based alloy with nickel and cobalt.