US 11,659,751 B2
Stacked transparent pixel structures for electronic displays
Mark A. Lamkin, Fort Worth, TX (US)
Assigned to Lockheed Martin Corporation, Bethesda, MD (US)
Filed by Lockheed Martin Corporation, Bethesda, MD (US)
Filed on Feb. 10, 2021, as Appl. No. 17/172,484.
Application 17/172,484 is a continuation of application No. 15/724,027, filed on Oct. 3, 2017, granted, now 10,930,709.
Prior Publication US 2021/0167140 A1, Jun. 3, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/32 (2006.01); H01L 27/146 (2006.01); H01L 27/30 (2006.01); H01L 51/52 (2006.01); H01L 33/08 (2010.01); H01L 33/42 (2010.01); H01L 51/50 (2006.01)
CPC H01L 27/3211 (2013.01) [H01L 27/14603 (2013.01); H01L 27/14647 (2013.01); H01L 27/307 (2013.01); H01L 27/326 (2013.01); H01L 33/08 (2013.01); H01L 33/42 (2013.01); H01L 51/504 (2013.01); H01L 51/5215 (2013.01); H01L 51/5234 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A system comprising:
a substrate;
a plurality of hexagon-shaped pixels coupled to the substrate, each hexagon-shaped pixel comprising:
a first subpixel coupled to the substrate;
a second subpixel on top of the first subpixel; and
a third subpixel on top of the second subpixel; and
six connector columns that electrically couple the first, second, and third subpixels to the substrate;
wherein:
each of the first, second, and third subpixels comprises an emissive layer located between a transparent cathode layer and a transparent anode layer; and
each transparent cathode layer and each transparent anode layer of each subpixel is electrically coupled to the substrate through a respective one of the six connector columns.