US 11,659,700 B2
Electromagnetic field shielding plate, method for manufacturing same, electromagnetic field shielding structure, and semiconductor manufacturing environment
Ichiro Miyano, Tokyo (JP); Osamu Komuro, Tokyo (JP); Masakazu Takahashi, Tokyo (JP); and Masashi Fujita, Tokyo (JP)
Assigned to Hitachi High-Tech Corporation, Tokyo (JP)
Appl. No. 17/294,576
Filed by Hitachi High-Tech Corporation, Tokyo (JP)
PCT Filed Jan. 15, 2019, PCT No. PCT/JP2019/000819
§ 371(c)(1), (2) Date May 17, 2021,
PCT Pub. No. WO2020/148796, PCT Pub. Date Jul. 23, 2020.
Prior Publication US 2022/0007556 A1, Jan. 6, 2022
Int. Cl. H05K 9/00 (2006.01); H01F 1/153 (2006.01); H01J 37/09 (2006.01); H01J 37/28 (2006.01); H01L 21/67 (2006.01)
CPC H05K 9/0088 (2013.01) [H01J 37/09 (2013.01); H01F 1/153 (2013.01); H01J 37/28 (2013.01); H01L 21/67017 (2013.01)] 27 Claims
OG exemplary drawing
 
1. An electromagnetic field shielding structure having
a first shielding plate including an electromagnetic field shielding plate configured by stacking a permalloy layer comprising a plate material or a sheet of permalloy and an amorphous layer comprising a plate material or a sheet of Fe—Si—B—Cu—Nb-based amorphous,
a second shielding plate including another electromagnetic field shielding plate, and
a ridge connection member, wherein:
the ridge connection member is configured by stacking at least a ridge permalloy layer comprising a plate material or a sheet of permalloy and a ridge stainless steel layer comprising an austenitic stainless steel material with a thickness in the range of 1.8 mm to 2.4 mm;
the ridge connection member has a ridge forming a first angle and is provided with female thread elements on both sides of the ridge;
at least a part on one side of the ridge of the ridge connection member and at least a part of the first shielding plate are fixed so as to overlap; and
at least a part on the other side of the ridge of the ridge connection member and at least a part of the second shielding plate are fixed so as to overlap.