US 11,659,699 B2
Power electronics unit
Sebastian Egger, Ehningen (DE); Matthias Ganz, Stuttgart (DE); Janko Horvat, Leibnitz (DE); Niklas Kull, Stuttgart (DE); and Peter Sever, Murska Sobota (SI)
Assigned to Mahle International GmbH
Appl. No. 17/259,156
Filed by Mahle International GmbH, Stuttgart (DE)
PCT Filed May 24, 2019, PCT No. PCT/EP2019/063487
§ 371(c)(1), (2) Date Jan. 8, 2021,
PCT Pub. No. WO2020/011438, PCT Pub. Date Jan. 16, 2020.
Claims priority of application No. 10 2018 211 520.6 (DE), filed on Jul. 11, 2018.
Prior Publication US 2021/0159148 A1, May 27, 2021
Int. Cl. H01L 23/473 (2006.01); H01L 23/373 (2006.01); F28F 13/02 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/20927 (2013.01) [F28F 13/02 (2013.01); H01L 23/3735 (2013.01); H01L 23/4735 (2013.01); H05K 7/20327 (2013.01); H05K 7/20345 (2013.01); H05K 1/0203 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A power electronics unit, comprising:
at least one circuit board including at least one electronic component which, in a heat transfer region, is disposed flat against an electronics side of the at least one circuit board in a heat-transferring manner;
a cooling device including at least one impingement jet chamber through which a cooling fluid is flowable from an inlet to an outlet;
the at least one impingement jet chamber heat-transferringly connected to the at least one circuit board on a cooling side disposed opposite the electronics side such that a power dissipation provided by the at least one electronic component is transferable, in the heat transfer region, to the cooling fluid in the at least one impingement jet chamber;
the cooling device further including at least one nozzle plate having at least one flow nozzle, the at least one nozzle plate arranged in and dividing the at least one impingement jet chamber into at least one inlet-side inlet chamber and at least one outlet-side outlet chamber, the at least one inlet chamber and the at least one outlet chamber fluidically connected to one another via the at least one flow nozzle;
wherein the at least one flow nozzle is arranged spaced apart from the heat transfer region of the at least one electronic component such that the at least one flow nozzle accelerates and conducts the cooling fluid flowing in through the inlet towards the heat transfer region of the at least one electronic component;
wherein the at least one outlet chamber is fluidically connected to the outlet via at least one draining passage, which on one side is delimited by at least one cover plate disposed against and coupled to the at least one nozzle plate and on the other side by the at least one nozzle plate; and
wherein the at least one draining passage is fluidically connected to the at least one outlet chamber via an outlet opening disposed in the at least one nozzle plate, which through the at least one nozzle plate fluidically connects the at least one draining passage with the at least one outlet chamber.