US 11,659,698 B2
Molded power module with integrated exciter circuit
Daniel Ruppert, Lenting (DE)
Assigned to AUDI AG, Ingolstadt (DE)
Filed by AUDI AG, Ingolstadt (DE)
Filed on Sep. 24, 2020, as Appl. No. 17/31,673.
Claims priority of application No. 102019125733.6 (DE), filed on Sep. 25, 2019.
Prior Publication US 2021/0092882 A1, Mar. 25, 2021
Int. Cl. H05K 7/20 (2006.01); H05K 7/14 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H02M 1/32 (2007.01); H01L 23/433 (2006.01); H01L 23/473 (2006.01); H02M 7/00 (2006.01)
CPC H05K 7/20927 (2013.01) [H01L 23/31 (2013.01); H01L 23/36 (2013.01); H01L 23/4334 (2013.01); H01L 23/473 (2013.01); H02M 1/32 (2013.01); H05K 7/1432 (2013.01); H05K 7/209 (2013.01); H05K 7/20945 (2013.01); H01L 23/3107 (2013.01); H02M 1/327 (2021.05); H02M 7/003 (2013.01); H05K 7/20254 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A power module for electric drives, comprising: at least one exciter circuit having at least one power semiconductor, wherein the power module is molded and the exciter circuit having the at least one power semiconductor is integrated in the molded power module, wherein the exciter circuit is a DC′DC converter, wherein the power module comprises a current sensor system which is integrated in the molded power module, and wherein the current sensor system comprises at least two measuring shunts, at least one filter, an integrator stage, a delta-sigma converter modulator, at least one galvanic separation and at least one receiver interface for an interface to a microcontroller.