US 11,659,694 B2
Computer system with external bypass air plenum
David Edward Bryan, Seattle, WA (US); Christopher Strickland Beall, Woodinville, WA (US); and Darin Lee Frink, Lake Tapps, WA (US)
Assigned to Amazon Technologies, Inc., Seattle, WA (US)
Filed by Amazon Technologies, Inc., Seattle, WA (US)
Filed on May 6, 2022, as Appl. No. 17/662,400.
Application 17/662,400 is a continuation of application No. 16/698,467, filed on Nov. 27, 2019, granted, now 11,330,740.
Application 16/698,467 is a continuation of application No. 15/798,272, filed on Oct. 30, 2017, granted, now 10,499,546, issued on Dec. 3, 2019.
Application 15/798,272 is a continuation of application No. 14/301,271, filed on Jun. 10, 2014, granted, now 9,807,911, issued on Oct. 31, 2017.
Prior Publication US 2022/0264770 A1, Aug. 18, 2022
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01); H01L 23/467 (2006.01); H05K 13/04 (2006.01); H01L 23/473 (2006.01)
CPC H05K 7/20754 (2013.01) [G06F 1/20 (2013.01); G06F 1/206 (2013.01); H01L 23/467 (2013.01); H05K 7/20727 (2013.01); H05K 13/04 (2013.01); H01L 23/473 (2013.01)] 20 Claims
OG exemplary drawing
 
16. A method, comprising:
flowing air through a first air plenum formed between a first side of a circuit board and an upper panel of a chassis, wherein the air flowing through the first air plenum cools one or more heat producing components mounted on the first side of the circuit board;
flowing additional air through a bypass air plenum formed in the chassis interior between a second side of the circuit board and a lower panel of the chassis, wherein the additional air flowing through the bypass air plenum flows beneath the one or more heat producing components mounted on the first side of the circuit board; and
channeling, by a baffle downstream of a gap, the air flowing through the bypass air plenum to flow, via the gap, out of the bypass air plenum and across another one or more heat producing components mounted on another component downstream of the gap.