US 11,659,692 B2
Rack assembly for vertical airflow cooled devices
Peter Alfred Devick Peterson, Bothell, WA (US); Nilofer Rajpurkar, Seattle, WA (US); John Reed Hannig, Hillsboro, OR (US); Patrick Gerard Brogan, Redmond, WA (US); Scott Allen Densmore, Redmond, WA (US); and Kenneth S. Hayd, Bothell, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Dec. 20, 2019, as Appl. No. 16/724,036.
Prior Publication US 2021/0195802 A1, Jun. 24, 2021
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20736 (2013.01) [G06F 1/206 (2013.01); H05K 7/20 (2013.01); Y02D 10/00 (2018.01)] 18 Claims
OG exemplary drawing
 
18. A system comprising:
a lower sub-assembly including a first fan;
a middle sub-assembly supported above the lower sub-assembly;
a bottom air flow control plane supported in the middle sub-assembly and having bottom openings, each bottom opening sized to fit and support a perimeter of a corresponding computer, each corresponding computer having a vertical cooling air path through a cylindrical shaped computer chassis such that air is forced through the vertical cooling air path;
a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having top openings sized to fit the corresponding computer through each top opening such that air is forced through a corresponding computer chassis bottom opening, the vertical cooling air path through each corresponding computer, and a corresponding computer chassis top opening; and
a bar beneath the bottom air flow control plane and in the lower sub-assembly positioned to support the corresponding computer chassis.