US 11,659,665 B2
Connection structure embedded substrate
Ho Hyung Ham, Suwon-si (KR); Won Seok Lee, Suwon-si (KR); and Jae Sung Sim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 30, 2021, as Appl. No. 17/217,264.
Claims priority of application No. 10-2020-0184112 (KR), filed on Dec. 28, 2020.
Prior Publication US 2022/0210921 A1, Jun. 30, 2022
Int. Cl. H05K 1/18 (2006.01); H01L 23/538 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/186 (2013.01) [H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H05K 1/119 (2013.01); H05K 1/181 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10522 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A connection structure-embedded substrate comprising:
a printed circuit board including a plurality of first insulating layers of which at least one has a cavity provided therein, a plurality of first wiring layers disposed as at least one of an outer portion and an inner portion of the plurality of first insulating layers, a first build-up insulating layer disposed on an upper surface of the plurality of first insulating layers, and a second build-up insulating layer disposed on the first build-up insulating layer; and
a connection structure at least partially disposed in the cavity and including a plurality of second insulating layers and a plurality of second wiring layers disposed as at least one of an outer portion and an inner portion of the plurality of second insulating layers,
wherein the first build-up insulating layer is disposed in the cavity,
each of a lower surface of the connection structure and a side surface of the connection structure connected to the lower surface of the connection structure is in contact with a same material of the first build-up insulating layer, respectively,
the printed circuit board further includes a plurality of first via layers,
one via of the plurality of first via layers penetrates a portion of the first build-up insulating layer, and has a tapered shape tapered in a direction from an upper surface of the first build-up insulating layer towards the plurality of first insulating layers,
the second build-up insulating layer is disposed also on the connection structure, and has a coefficient of thermal expansion lower than that of the first build-up insulating layer, and
a first pitch is greater than a second pitch in which the first pitch is a pitch of at least one of the plurality of first wiring layers, and the second pitch is a pitch of at least one of the plurality of second wiring layers.