US 11,659,648 B2
Metal body formed on a component carrier by additive manufacturing
Marco Gavagnin, Leoben (AT); and Jonathan Silvano de Sousa, Vienna (AT)
Assigned to AT&S Austria Technologie & Systemtechnik AG, Leoben (AT)
Filed by AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed on Oct. 5, 2018, as Appl. No. 16/152,659.
Claims priority of application No. 17195322 (EP), filed on Oct. 6, 2017.
Prior Publication US 2019/0110357 A1, Apr. 11, 2019
Int. Cl. H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); B22F 7/08 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); H05K 3/12 (2006.01); B22F 10/20 (2021.01)
CPC H05K 1/0206 (2013.01) [B22F 7/08 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); H05K 1/021 (2013.01); H05K 1/0209 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 3/1241 (2013.01); H05K 3/4644 (2013.01); H05K 3/4664 (2013.01); B22F 10/20 (2021.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/107 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A component carrier, comprising:
a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures;
a component with a metal surface structure mounted on or in the carrier body, the metal surface structure of the component extending beyond an external surface of the carrier body and directly coupled to the layer structures, wherein at least a portion of the metal surface structure contacts at least one of a thermally conductive casing and a contact area of the component; and
a metal body directly on the metal surface structure, the metal body outside of the carrier body,
wherein the metal body is directly formed by additive manufacturing on the metal surface structure without an isolating layer between the component and the metal body.