US 11,658,418 B2
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems
Feras Eid, Chandler, AZ (US); Sasha N. Oster, Marion, IA (US); Telesphor Kamgaing, Chandler, AZ (US); Georgios C. Dogiamis, Chandler, AZ (US); and Aleksandar Aleksov, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on May 11, 2021, as Appl. No. 17/317,332.
Application 17/317,332 is a continuation of application No. 16/345,171, granted, now 11,050,155, previously published as PCT/US2016/066717, filed on Dec. 14, 2016.
Prior Publication US 2021/0265732 A1, Aug. 26, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 9/04 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 1/52 (2006.01); H01Q 19/22 (2006.01); H01L 23/367 (2006.01)
CPC H01Q 9/0414 (2013.01) [H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/49541 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/241 (2013.01); H01Q 1/526 (2013.01); H01Q 19/22 (2013.01); H01L 23/3675 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectronic device comprising:
a first substrate having radio frequency (RF) components, the first substrate having an uppermost surface;
a second substrate coupled to the first substrate, the second substrate including a first conductive layer of an antenna unit; and
a mold material disposed on the first and second substrates, the mold material including a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material, and the mold material having an uppermost surface above the uppermost surface of the first substrate, wherein the second conductive layer of the antenna unit is on the uppermost surface of the mold material.