US 11,658,393 B2
Electronic device with radio-frequency module
Hak Gu Kim, Suwon-si (KR); Young Sik Hur, Suwon-si (KR); Yoo Sam Na, Suwon-si (KR); Won Gi Kim, Suwon-si (KR); Young Bal Kim, Suwon-si (KR); Soo Ki Choi, Suwon-si (KR); Ho Kyung Kang, Suwon-si (KR); Young Kyoon Im, Suwon-si (KR); and Seong Jong Cheon, Suwon-si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed on Jun. 22, 2021, as Appl. No. 17/354,425.
Application 17/354,425 is a continuation of application No. 16/937,981, filed on Jul. 24, 2020, granted, now 11,335,991.
Claims priority of application No. 10-2019-0145360 (KR), filed on Nov. 13, 2019; and application No. 10-2020-0021584 (KR), filed on Feb. 21, 2020.
Prior Publication US 2021/0313672 A1, Oct. 7, 2021
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/08 (2006.01); H01Q 21/28 (2006.01); H04B 1/16 (2006.01); H04B 1/04 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/085 (2013.01); H01Q 21/28 (2013.01); H04B 1/04 (2013.01); H04B 1/16 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An antenna module comprising:
first and second antennas;
first and second integrated circuits (ICs) electrically connected to the first and second antennas, respectively;
a first substrate connected between the first antenna and the first IC;
a second substrate connected between the second antenna and the second IC;
a flexible substrate electrically connected between the first and second substrates and having a flexibility greater than flexibilities of each of the first and second substrates; and
a third IC connected to the first substrate, electrically connected to the first IC through the first substrate, and electrically connected to the second IC through the first substrate, the flexible substrate, and the second substrate.