US 11,658,373 B2
Packaging structure including a substrate having a coplanar waveguide, an air bridge and a superconducting material compensating structure formed thereon
Hua Xu, Hangzhou (CN); and Jin Qin, Hangzhou (CN)
Assigned to Alibaba Group Holding Limited, Grand Cayman (KY)
Filed on May 13, 2021, as Appl. No. 17/319,870.
Claims priority of application No. 202010403384.7 (CN), filed on May 13, 2020.
Prior Publication US 2021/0359384 A1, Nov. 18, 2021
Int. Cl. H01P 3/00 (2006.01); H05K 1/02 (2006.01)
CPC H01P 3/003 (2013.01) [H05K 1/0237 (2013.01)] 15 Claims
OG exemplary drawing
1. A packaging structure, comprising:
a substrate;
a coplanar waveguide comprising a first ground wire, a second ground wire, and a signal wire, wherein the first ground wire, the second ground wire, and the signal wire are disposed on a surface of the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire;
an air bridge comprising a first end connected with the first ground wire and a second end connected with the second ground wire, wherein a first gap exists between the air bridge and a surface of the signal wire away from the substrate; and
a compensation structure configured to contact at least one of the substrate, the coplanar waveguide or the air bridge, wherein a material of the compensation structure comprises a superconducting material.