US 11,658,373 B2
Packaging structure including a substrate having a coplanar waveguide, an air bridge and a superconducting material compensating structure formed thereon
Hua Xu, Hangzhou (CN); and Jin Qin, Hangzhou (CN)
Assigned to Alibaba Group Holding Limited, Grand Cayman (KY)
Filed by ALIBABA GROUP HOLDING LIMITED, Grand Cayman (KY)
Filed on May 13, 2021, as Appl. No. 17/319,870.
Claims priority of application No. 202010403384.7 (CN), filed on May 13, 2020.
Prior Publication US 2021/0359384 A1, Nov. 18, 2021
Int. Cl. H01P 3/00 (2006.01); H05K 1/02 (2006.01)
CPC H01P 3/003 (2013.01) [H05K 1/0237 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A packaging structure, comprising:
a substrate;
a coplanar waveguide comprising a first ground wire, a second ground wire, and a signal wire, wherein the first ground wire, the second ground wire, and the signal wire are disposed on a surface of the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire;
an air bridge comprising a first end connected with the first ground wire and a second end connected with the second ground wire, wherein a first gap exists between the air bridge and a surface of the signal wire away from the substrate; and
a compensation structure configured to contact at least one of the substrate, the coplanar waveguide or the air bridge, wherein a material of the compensation structure comprises a superconducting material.