US 11,658,271 B2
DUV LED module structure
Bin-Chun Hsieh, Tianzhong Township (TW); Siang-Jyun Chen, Tianzhong Township (TW); and Sin-yu Chen, Tianzhong Township (TW)
Assigned to Cheng Mei Optronics Inc., Tianzhong Township (TW)
Filed by Cheng Mei Optronics Inc., Tianzhong Township, Changhua County (TW)
Filed on Apr. 2, 2021, as Appl. No. 17/220,979.
Claims priority of application No. 109112302 (TW), filed on Apr. 9, 2020.
Prior Publication US 2021/0320230 A1, Oct. 14, 2021
Int. Cl. H01L 33/48 (2010.01); H01L 25/16 (2023.01); H01L 33/64 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01)
CPC H01L 33/486 (2013.01) [H01L 25/165 (2013.01); H01L 25/167 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/642 (2013.01)] 15 Claims
OG exemplary drawing
1. A deep ultraviolet (DUV) light-emitting diode (LED) module structure comprising:
a holder configured to accommodate a substrate, and the holder including a receiving cup mounted therein and a transparent layer mounted on a top of the receiving cup;
wherein the holder includes a DUV LED chip adhered on the substrate, and the holder, the substrate, and the DUV LED chip are connected and packaged, and
wherein the transparent layer includes a press sheet mounted on a top thereof, having a specific reflection angle, and configured to fix the transparent layer.