US 11,658,252 B2
High optical power light conversion device using a phosphor element with solder attachment
Michael P. Newell, Groton, MA (US); Zan Aslett, Brookline, NH (US); Robert Cuzziere, Westford, MA (US); Andrew P. Houde, Lowell, MA (US); and Derrick Brown, Hamilton (CA)
Filed by Materion Corporation, Mayfield Heights, OH (US)
Filed on Jan. 13, 2022, as Appl. No. 17/574,994.
Application 17/574,994 is a continuation of application No. 17/032,877, filed on Sep. 25, 2020, granted, now 11,289,616.
Application 17/032,877 is a continuation of application No. 15/274,288, filed on Sep. 23, 2016, granted, now 10,833,211, issued on Nov. 10, 2020.
Claims priority of provisional application 62/265,117, filed on Dec. 9, 2015.
Claims priority of provisional application 62/232,702, filed on Sep. 25, 2015.
Prior Publication US 2022/0140158 A1, May 5, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 31/0232 (2014.01); H01L 31/024 (2014.01); H01L 31/18 (2006.01); C03C 14/00 (2006.01); C04B 37/02 (2006.01); G03B 21/20 (2006.01); G03B 21/16 (2006.01); H01L 33/64 (2010.01); H01L 33/50 (2010.01)
CPC H01L 31/02327 (2013.01) [C03C 14/006 (2013.01); C04B 37/026 (2013.01); G03B 21/16 (2013.01); G03B 21/204 (2013.01); H01L 31/024 (2013.01); H01L 31/18 (2013.01); C04B 2237/122 (2013.01); C04B 2237/123 (2013.01); C04B 2237/125 (2013.01); C04B 2237/127 (2013.01); C04B 2237/34 (2013.01); C04B 2237/341 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/402 (2013.01); C04B 2237/407 (2013.01); C04B 2237/72 (2013.01); C04B 2237/84 (2013.01); H01L 33/501 (2013.01); H01L 33/505 (2013.01); H01L 33/507 (2013.01); H01L 33/644 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light conversion device comprising:
a phosphor wheel including:
an optoceramic phosphor element comprising one or more phosphors embedded in a ceramic host;
a metal heat sink which is a metal disk rotatable about a central axis;
a solder bond disposed on the metal heat sink; and
a solderable stack including at least one layer disposed on a back side of the optoceramic phosphor element between the optoceramic phosphor element and the solder bond;
wherein the metal heat sink is attached with the solderable stack by the solder bond on an outer rim of the metal heat sink.