US 11,658,162 B2
Micro-LED display and manufacturing method therefor
Youngchul Lee, Hwaseong-si (KR); Taesang Park, Seoul (KR); Kyoree Lee, Suwon-si (KR); Tackmo Lee, Suwon-si (KR); Gyun Heo, Suwon-si (KR); Youngjun Moon, Hwaseong-si (KR); and Won Choi, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Appl. No. 16/629,768
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
PCT Filed Jun. 26, 2018, PCT No. PCT/KR2018/007191
§ 371(c)(1), (2) Date Jan. 9, 2020,
PCT Pub. No. WO2019/013469, PCT Pub. Date Jan. 17, 2019.
Claims priority of application No. 10-2017-0087003 (KR), filed on Jul. 10, 2017; application No. 10-2017-0124233 (KR), filed on Sep. 26, 2017; and application No. 10-2018-0060319 (KR), filed on May 28, 2018.
Prior Publication US 2021/0375833 A1, Dec. 2, 2021
Int. Cl. H01L 25/075 (2006.01); H01L 25/16 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/52 (2010.01)
CPC H01L 25/0753 (2013.01) [H01L 25/167 (2013.01); H01L 33/0095 (2013.01); H01L 33/62 (2013.01); H01L 33/0093 (2020.05); H01L 33/52 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method comprising:
attaching micro LED chips having a first arrangement to a carrier film;
re-arranging the micro LED chips on a temporary fixing film in an Red Green Blue (RGB) second arrangement in accordance with a display pixel configuration, using a pickup device;
fixing the re-arranged micro LED chips in a mold;
coating a photosensitive material on connecting pads of the micro LED chips to fix locations for coupling the connecting pads to circuits on a printed circuit board (PCB); and
bonding the PCB to a face of the mold.