US 11,658,147 B2
Semiconductor manufacturing apparatus
Ilhyoung Koo, Asan-si (KR); Youngshin Choi, Asan-si (KR); and Changho Lee, Asan-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Sep. 29, 2021, as Appl. No. 17/489,310.
Claims priority of application No. 10-2021-0038272 (KR), filed on Mar. 24, 2021.
Prior Publication US 2022/0310551 A1, Sep. 29, 2022
Int. Cl. B23K 1/00 (2006.01); H01L 23/00 (2006.01); B23K 1/018 (2006.01); B23K 1/20 (2006.01); B23K 101/40 (2006.01)
CPC H01L 24/75 (2013.01) [B23K 1/018 (2013.01); B23K 1/206 (2013.01); H01L 24/799 (2013.01); B23K 2101/40 (2018.08); H01L 2224/7501 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/75753 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing apparatus comprising:
a component separating apparatus configured to separate a defective component from a substrate;
a bump conditioning apparatus including an end mill cutter and receiving the substrate following separation of the defective component from the substrate, the bump conditioning apparatus being configured to cut a first connection bump using the end mill cutter to provide a conditioned first connection bump, and the first connection bump being exposed by separating the defective component from the substrate; and
a component attaching apparatus configured to receive the substrate following provision of the conditioned first connection bump and mount a new component including a second connection bump to the substrate by coupling the second connection bump and the conditioned first connection bump.